发明授权
- 专利标题： Large area flat image sensor assembly
- 专利标题（中）： 大面积平面图像传感器组件
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申请号： US10922529申请日： 2004-08-20
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公开(公告)号： US07276394B2公开(公告)日： 2007-10-02
- 发明人: Jaime I. Waldman , Mario J. Ciminelli , Michael A. Marcus
- 申请人： Jaime I. Waldman , Mario J. Ciminelli , Michael A. Marcus
- 申请人地址： US NY Rochester
- 专利权人： Eastman Kodak Company
- 当前专利权人： Eastman Kodak Company
- 当前专利权人地址： US NY Rochester
- 代理商 Peyton C. Watkins
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A low temperature method for producing a substantially flat large area image sensor assembly, the method includes the steps of providing a die attach substrate having a substantially planar surface; providing a lead frame having a bonding surface and a plurality of leads extending there from; adhering an imager die to the substantially planar surface of the die attach substrate with a low curing temperature first adhesive; and adhering the die attach substrate with adhered imager die to a bonding surface of the lead frame with a low curing temperature second adhesive for producing an image sensor assembly.
公开/授权文献
- US20050019987A1 Large area flat image sensor assembly 公开/授权日：2005-01-27
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