发明授权
- 专利标题： Semiconductor device and semiconductor module
- 专利标题（中）： 半导体器件和半导体模块
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申请号： US11054025申请日： 2005-02-08
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公开(公告)号： US07276793B2公开(公告)日： 2007-10-02
- 发明人: Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Shigeaki Mashimo , Katsumi Okawa , Eiju Maehara , Kouji Takahashi
- 申请人： Noriaki Sakamoto , Yoshiyuki Kobayashi , Junji Sakamoto , Shigeaki Mashimo , Katsumi Okawa , Eiju Maehara , Kouji Takahashi
- 申请人地址： JP Osaka
- 专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Fish & Richardson P.C.
- 优先权： JPP.2000-022646 20000131; JPP.2000-024047 20000201; JPP.2000-032417 20000209; JPP.2000-032454 20000209; JPP.2000-135283 20000509; JPP.2000-285562 20000920
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A semiconductor device is provided wherein conductive paths 40, formed of crystal that grows better along the X-Y axis than along the Z axis, are embedded in an insulating resin 44, and the back surface of the conductive path 40 is exposed through the insulating resin 44 and sealed. With this arrangement, fractures of the conductive paths 40 embedded in the insulating resin 44 are suppressed.
公开/授权文献
- US20050146052A1 Semiconductor device and semiconductor module 公开/授权日：2005-07-07
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