发明授权
- 专利标题： Epoxy compound and cured epoxy resin product
- 专利标题（中）： 环氧化合物和固化环氧树脂产品
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申请号： US10560891申请日： 2004-06-18
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公开(公告)号： US07279574B2公开(公告)日： 2007-10-09
- 发明人: Shinya Tanaka , Yoshitaka Takezawa , Hiroyuki Takahashi
- 申请人： Shinya Tanaka , Yoshitaka Takezawa , Hiroyuki Takahashi
- 申请人地址： JP Tokyo JP Tokyo
- 专利权人： Sumitomo Chemical Company, Limited,Hitachi, Ltd.
- 当前专利权人： Sumitomo Chemical Company, Limited,Hitachi, Ltd.
- 当前专利权人地址： JP Tokyo JP Tokyo
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2003-174545 20030619
- 国际申请： PCT/JP2004/008934 WO 20040618
- 国际公布： WO2004/113327 WO 20041229
- 主分类号： C07D401/00
- IPC分类号： C07D401/00 ; C07D237/00 ; C07D405/00 ; C07D211/00 ; C07D303/12 ; C08G59/14 ; C08F283/00 ; C08L63/00
摘要：
The present invention provides a novel epoxy compound, which can be converted into a cured epoxy resin product having liquid crystal properties by curing with a curing agent. Since the cured epoxy resin product of the present invention exhibits good heat conductivity, it is also useful as an insulating material requiring high heat releasability such as a printed circuit substrate and the like.
公开/授权文献
- US20060159929A1 Epoxy compound and cured epoxy resin product 公开/授权日：2006-07-20
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