Invention Grant
- Patent Title: Shaped wall plate for wiring device
- Patent Title (中): 接线装置形状的墙板
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Application No.: US10852812Application Date: 2004-05-25
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Publication No.: US07282642B2Publication Date: 2007-10-16
- Inventor: Gerd Schmieta , Michael Meyer , Dennis A. Oddsen , Anthony Tufano , Leslie Lindenstraus , James J. Sherman , Tim Langfit
- Applicant: Gerd Schmieta , Michael Meyer , Dennis A. Oddsen , Anthony Tufano , Leslie Lindenstraus , James J. Sherman , Tim Langfit
- Applicant Address: US NY Little Neck
- Assignee: Leviton Manufacturing Co., Inc.
- Current Assignee: Leviton Manufacturing Co., Inc.
- Current Assignee Address: US NY Little Neck
- Agent Paul J. Sutton
- Main IPC: H02G3/14
- IPC: H02G3/14

Abstract:
There is disclosed a wall plate for a wiring device. The wall plate has a single opening for receiving one or a gang of two or more wiring devices within the single opening. The wall plate has along its vertical axis, a surface of positive first differential and zero second differential, comprised of a combination of splines drawn between points of varying distance from a datum plane. The surface has zero second differential when the rate of height increase of individual splines is constant. The wall plate, when composed of non-conducting material, has a conductive coating on its front surface, on its back surface or on both its front and back surfaces. When the wiring device is a switch, the surface of the switch face follows that of the wall plate. When the wiring device is a receptacle, the surface along the receptacle face is flat in one plane to allow for the proper seating of an inserted plug.
Public/Granted literature
- US20050122666A1 Shaped wall plate for wiring device Public/Granted day:2005-06-09
Information query
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