Invention Grant
US07282648B2 Capacitor-embedded PCB having blind via hole and method of manufacturing the same
有权
具有盲孔的电容器嵌入式PCB及其制造方法
- Patent Title: Capacitor-embedded PCB having blind via hole and method of manufacturing the same
- Patent Title (中): 具有盲孔的电容器嵌入式PCB及其制造方法
-
Application No.: US11356524Application Date: 2006-02-16
-
Publication No.: US07282648B2Publication Date: 2007-10-16
- Inventor: Han Kim , Chang Myung Ryu , Young Jae Lee
- Applicant: Han Kim , Chang Myung Ryu , Young Jae Lee
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Darby & Darby P.C.
- Priority: KR10-2005-0022703 20050318
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
The present invention relates to a capacitor-embedded PCB and a method of manufacturing the same. The capacitor-embedded PCB includes a dielectric layer, a lower electrode layer formed under the dielectric layer, and an upper electrode layer formed on the dielectric layer and configured to have at least one first blind via hole that is inwardly formed.
Public/Granted literature
- US20060207791A1 Capacitor-embedded PCB having blind via hole and method of manufacturing the same Public/Granted day:2006-09-21
Information query
