发明授权
- 专利标题: Stack MCP
- 专利标题(中): 堆栈MCP
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申请号: US10891513申请日: 2004-07-15
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公开(公告)号: US07285864B2公开(公告)日: 2007-10-23
- 发明人: Shinya Takyu , Kazuhiro Iizuka , Mika Kiritani
- 申请人: Shinya Takyu , Kazuhiro Iizuka , Mika Kiritani
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Finnegan, Henderson, Farabow, Garrett, & Dunner, L.L.P.
- 优先权: JP2004-036446 20040213
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H01L23/52 ; H01L29/40
摘要:
A semiconductor chip having an adhesive layer previously formed on an element forming surface thereof and having a bump exposed from the surface of the adhesive layer is wire-bonded to a printed circuit board. Another semiconductor chip is stacked on the above semiconductor chip with the adhesive layer disposed therebetween and is wire-bonded to the printed circuit board by wire bonding. Likewise, at least one semiconductor chip is sequentially stacked on the thus attained semiconductor structure to form a stack MCP.
公开/授权文献
- US20050179127A1 Stack MCP and manufacturing method thereof 公开/授权日:2005-08-18