发明授权
- 专利标题： Grounding device for bundled cables
- 专利标题（中）： 捆扎电缆接地装置
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申请号： US11523108申请日： 2006-09-19
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公开(公告)号： US07288720B1公开(公告)日： 2007-10-30
- 发明人: Kevin Moyher , Raymond Allard , Paul Merola , Tao Duan , Jun Zhang , Xin Fu , Wei Wang , Tai Qui , Jason Zhu , Yunchuan Zhu
- 申请人： Kevin Moyher , Raymond Allard , Paul Merola , Tao Duan , Jun Zhang , Xin Fu , Wei Wang , Tai Qui , Jason Zhu , Yunchuan Zhu
- 申请人地址： US CT Wallingford
- 专利权人： Times Microwave Systems, Inc.
- 当前专利权人： Times Microwave Systems, Inc.
- 当前专利权人地址： US CT Wallingford
- 代理机构： McCormick, Paulding & Huber LLP
- 主分类号： H02G15/08
- IPC分类号： H02G15/08
摘要：
A device for electrically grounding bundled cables includes a first half component having an outer surface portion and an abutting surface portion, and a second half component having an outer surface portion and an abutting surface portion. The outer surface portion of the first half component and the outer surface portion of the second half component each define at least one groove longitudinally extending therealong for accommodating one of a plurality of cables held closely together in a bundled configuration. The abutting surface portion of the first half component and the abutting surface portion of the second half component are configured for engaging and cooperating with one another to form a grounding structure.
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