发明授权
- 专利标题: Interposable heat sink for adjacent memory modules
- 专利标题(中): 相邻内存模块的可插入散热片
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申请号: US11093445申请日: 2005-03-30
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公开(公告)号: US07289331B2公开(公告)日: 2007-10-30
- 发明人: Jimmy Grant Foster, Sr. , Michael Sean June , Vinod Kamath , Beth Frayne Loebach , Albert Vincent Makley , Jason Aaron Matteson
- 申请人: Jimmy Grant Foster, Sr. , Michael Sean June , Vinod Kamath , Beth Frayne Loebach , Albert Vincent Makley , Jason Aaron Matteson
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Synnestvedt & Lechner LLP
- 代理商 Cynthia Bird, Esq.
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A h9eat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.
公开/授权文献
- US20060221578A1 Interposable heat sink for adjacent memory modules 公开/授权日:2006-10-05