发明授权
- 专利标题： Thermoconductive silicone composition
- 专利标题（中）： 热固性硅氧烷组合物
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申请号： US10544909申请日： 2004-02-09
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公开(公告)号： US07291671B2公开(公告)日： 2007-11-06
- 发明人: Hiroshi Fukui
- 申请人： Hiroshi Fukui
- 申请人地址： JP Tokyo
- 专利权人： Dow Corning Toray Company, Ltd.
- 当前专利权人： Dow Corning Toray Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2003-034744 20030213
- 国际申请： PCT/JP2004/001356 WO 20040209
- 国际公布： WO2004/072181 WO 20040826
- 主分类号： C08L83/06
- IPC分类号： C08L83/06
摘要：
A thermoconductive silicone composition comprising: (A) an organopolysiloxane (excluding component (C)), (B) a thermoconductive filler, and (C) at least two organopolysiloxanes as defined by the following general formula that have different values for the subscript n (I), wherein each R1 is independently selected from monovalent hydrocarbon groups; R2 is an oxygen atom or divalent hydrocarbon group; R3 is an alkyl, alkoxyalkyl, alkenyl, or acyl; n is an integer from 5 to 100; and a is an integer from 1 to 3
公开/授权文献
- US20060135687A1 Thermoconductive silicone composition 公开/授权日：2006-06-22
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