A method of manufacturing a semiconductor device, includes: forming an insulating layer on a single crystal semiconductor substrate; forming a non-crystalline semiconductor layer on the insulating layer; forming an insulating film on the non-crystalline semiconductor layer; forming an opening section for exposing a part of a surface of the single crystal semiconductor substrate through the insulating film, the non-crystalline semiconductor layer and the insulating layer; forming a single crystal semiconductor layer embedded in the opening section so as to have contact with the non-crystalline semiconductor layer; removing the insulating film and the insulating layer while the single crystal semiconductor layer supporting the non-crystalline semiconductor layer above the single crystal semiconductor substrate; forming a single-crystallized semiconductor layer obtained by single-crystallizing the non-crystalline semiconductor layer using the single crystal semiconductor layer as a seed by providing a thermal treatment on the non-crystalline semiconductor layer from which the insulating film and the insulating layer are removed; filling a gap between the single-crystallized semiconductor layer and the single crystal semiconductor substrate with an embedded insulating layer; forming a gate electrode on the single-crystallized semiconductor layer; and forming in the single-crystallized semiconductor layer a source layer disposed on one side of the gate electrode and a drain layer disposed on the other side of the gate electrode.