Invention Grant
- Patent Title: Ultrathin leadframe BGA circuit package
- Patent Title (中): 超薄引线框BGA电路封装
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Application No.: US10233159Application Date: 2002-08-29
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Publication No.: US07294911B2Publication Date: 2007-11-13
- Inventor: Teck Kheng Lee , Tan Yong Kian , Setho Sing Fee
- Applicant: Teck Kheng Lee , Tan Yong Kian , Setho Sing Fee
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Priority: SG200202330 20020419
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A circuit package is formed using a leadframe. The leadframe is formed or etched to align a plurality of bond pad structures above a reference plane while supporting leadframe fingers are positioned below the reference plane. Jumper wires are wirebonded between terminals on the die and the bond pads to form a package subassembly. The subassembly is encapsulated and then background to remove the leadframe fingers and surrounding frame. The bond pads which remain embedded in the encapsulation material are exposed on the lower surface of the package for connection to further conductors.
Public/Granted literature
- US20030197267A1 Ultrathin leadframe BGA circuit package Public/Granted day:2003-10-23
Information query
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