Embodiments of the present invention provide a mounting assembly (100) for mounting an electronic device (D) to a surface (S). The mounting assembly (100) generally includes a base (102) including a mounting ball (110) and a socket assembly (104) operable to frictionally engage the ball (110) to removably couple the socket assembly (104) to the base (102). The base (102) may be removably coupled with the surface (S) and the socket assembly (104) may be removably coupled with the electronic device (D). Such a configuration enables the electronic device (D) to be easily positioned in confined environments by first attaching the base (102) to the surface (S), then attaching the socket assembly (104) to the base (102) and positioning the socket assembly (104) in a desired orientation, and finally attaching the electronic device (D) to the socket assembly (104).