Invention Grant
- Patent Title: Semiconductor multi-chip package and fabrication method
- Patent Title (中): 半导体多芯片封装及制造方法
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Application No.: US10787679Application Date: 2004-02-25
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Publication No.: US07298032B2Publication Date: 2007-11-20
- Inventor: Dong-Kuk Kim , Chang-Cheol Lee
- Applicant: Dong-Kuk Kim , Chang-Cheol Lee
- Applicant Address: KR Suwon-si, Gyeongi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeongi-do
- Agency: Marger Johnson & McCollom, P.C.
- Priority: KR10-2003-0021922 20030408
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A multi-chip package comprises a package substrate having bond fingers disposed thereon. A first chip have center bonding pads formed on a substantially center portion thereof. The first chip is disposed on the package substrate. Insulating support structures are formed on the first chip located outward of the bonding pads. A bonding wire is connected between one of the bond fingers and at least one of the center bonding pads. A second chip has is disposed over the bonding wire and overlying the insulating support structures.
Public/Granted literature
- US20040201088A1 Semiconductor multi-chip package and fabrication method Public/Granted day:2004-10-14
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