发明授权
- 专利标题: Pattern forming method, method of manufacturing electronic apparatus, and method of manufacturing substrate
- 专利标题(中): 图案形成方法,电子设备的制造方法以及基板的制造方法
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申请号: US11207931申请日: 2005-08-22
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公开(公告)号: US07300132B2公开(公告)日: 2007-11-27
- 发明人: Toshimitsu Hirai , Shinri Sakai
- 申请人: Toshimitsu Hirai , Shinri Sakai
- 申请人地址: JP Tokyo
- 专利权人: Seiko Epson Corporation
- 当前专利权人: Seiko Epson Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff & Berridge PLC
- 优先权: JP2004-267874 20040915
- 主分类号: B41J29/393
- IPC分类号: B41J29/393 ; B41J29/38 ; H01L21/00 ; H01L21/20
摘要:
A pattern forming method is a method of forming a pattern on a surface of an object by using a droplet discharge device that discharges a first droplet and a second droplet from nozzles. The pattern forming method includes when coordinates on the object surface are represented by integers m and n, and two integers other than zero are represented by i and j, forming a bank pattern that borders a pattern formation region such that a range of a first projection image of the first droplet when a landable position with a coordinate (m, n) substantially coincides with the center of the first projection image and a range of a second projection image of the second droplet when a landable position with a coordinate (m+i, n+j) substantially coincides with the center of the second projection image fall within the pattern formation region on the surface of the object; and forming a pattern that covers the pattern formation region by discharging the first droplet to the landable position with the coordinate (m, n) and by discharging the second droplet to the landable position with the coordinate (m+i, n+j). Further, the distance between the landable position with the coordinate (m, n) and the landable position with the coordinate (m+i, n+j) is determined such that the first droplet and the second droplet flow into each other after the first and second droplets spread on the pattern formation region.
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