Invention Grant
- Patent Title: Permalloy loaded transmission lines for high-speed interconnect applications
- Patent Title (中): 坡莫合金加载传输线用于高速互连应用
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Application No.: US11018924Application Date: 2004-12-22
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Publication No.: US07304555B2Publication Date: 2007-12-04
- Inventor: Pingshan Wang , Edwin C. Kan
- Applicant: Pingshan Wang , Edwin C. Kan
- Applicant Address: US NY Ithaca
- Assignee: Cornell Research Foundation, Inc.
- Current Assignee: Cornell Research Foundation, Inc.
- Current Assignee Address: US NY Ithaca
- Agency: Jones, Tullar & Cooper, P.C.
- Main IPC: H01P3/08
- IPC: H01P3/08

Abstract:
To facilitate high frequency operation, transmission lines for high-speed interconnect applications in CMOS technologies are loaded with patterned permalloy or other ferromagnetic material films. Patterning the permalloy films as a plurality of segments results in control of the domain structures in the permalloy segments such that ferromagnetic resonance (FMR) effects are eliminated and eddy-current effects are reduced, thereby allowing operation of the transmission lines at frequencies of 20 GHz or higher. In addition, the patterned permalloy reduces the magnetic field coupling between two adjacent transmission lines. A novel ferromagnetic thin film characterization method is also employed to measure the microwave permeability of the patterned permalloy films and verify their high frequency operational characteristics.
Public/Granted literature
- US20050212627A1 Permalloy loaded transmission lines for high-speed interconnect applications Public/Granted day:2005-09-29
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