发明授权
- 专利标题: Method of cleaning a semiconductor substrate
- 专利标题(中): 清洗半导体衬底的方法
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申请号: US10843444申请日: 2004-05-12
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公开(公告)号: US07306681B2公开(公告)日: 2007-12-11
- 发明人: Ya-Lun Cheng , Yi-Chia Lee , Yu-Ren Wang , Neng-Hui Yang
- 申请人: Ya-Lun Cheng , Yi-Chia Lee , Yu-Ren Wang , Neng-Hui Yang
- 申请人地址: TW
- 专利权人: United Microelectronics Corp.
- 当前专利权人: United Microelectronics Corp.
- 当前专利权人地址: TW
- 代理机构: Squire Sanders & Dempsey LLP
- 主分类号: B08B3/00
- IPC分类号: B08B3/00
摘要:
A cleaning method and cleaning recipes are disclosed. The present invention relates to a method for cleaning a semiconductor substrate and cleaning recipes. The present invention utilizes a first cleaning solution including diluted hydrofluoric acid and a second cleaning solution including hydrogen chloride and hydrogen peroxide (H2O2) to clean a semiconductor substrate without using an alkaline solution including ammonium hydroxide. Accordingly, a clean surface of a semiconductor substrate is provided in selective epitaxial growth (SEG) process to grow an epitaxial layer with smooth surface.
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