发明授权
- 专利标题: Circuit board for cable termination
- 专利标题(中): 电缆终端电路板
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申请号: US11034072申请日: 2005-01-12
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公开(公告)号: US07307220B2公开(公告)日: 2007-12-11
- 发明人: Christopher M. Barnette
- 申请人: Christopher M. Barnette
- 申请人地址: US TX Houston
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Houston
- 主分类号: H05K1/03
- IPC分类号: H05K1/03
摘要:
Various embodiments of an apparatus, circuit board, and method are disclosed for cable termination. In one embodiment, a surface pad is disposed on a surface of the circuit board. A ground conductor is in the circuit board, the ground conductor being parallel to and collateral to the at least one surface pad. Also, at least one antipad is positioned between the at least one surface pad and the ground conductor, wherein a nonconductive volume extends from the surface pad to the ground conductor through the at least one antipad.
公开/授权文献
- US20060151200A1 Circuit board for cable termination 公开/授权日:2006-07-13
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