Invention Grant
- Patent Title: Integrated circuit package system with heat sink
- Patent Title (中): 集成电路封装系统带散热片
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Application No.: US11307350Application Date: 2006-02-01
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Publication No.: US07309622B2Publication Date: 2007-12-18
- Inventor: Minseok Kim , Tae Keun Lee
- Applicant: Minseok Kim , Tae Keun Lee
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
An integrated circuit package system includes providing a substrate. An integrated circuit is attached to the substrate. A plurality of support bars is formed on the substrate. A plurality of adhesive structures is formed. A heat sink is attached to the plurality of adhesive structures. The integrated circuit is encapsulated. The support bars are removed.
Public/Granted literature
- US20070111397A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEAT SINK Public/Granted day:2007-05-17
Information query
IPC分类:
