发明授权
- 专利标题： Circuit board, liquid discharge apparatus, and method of manufacturing the circuit board
- 专利标题（中）： 电路板，液体排出装置以及制造电路板的方法
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申请号： US10929492申请日： 2004-08-31
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公开(公告)号： US07309657B2公开(公告)日： 2007-12-18
- 发明人: Masato Kamiichi , Keiichi Sasaki
- 申请人： Masato Kamiichi , Keiichi Sasaki
- 申请人地址： JP Tokyo
- 专利权人： Canon Kabushiki Kaisha
- 当前专利权人： Canon Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 代理机构： Fitzpatrick, Cella, Harper & Scinto
- 优先权： JP2003-312634 20030904
- 主分类号： H01L21/302
- IPC分类号： H01L21/302
摘要：
Provided is a method for manufacturing a circuit board including an electrode wiring formed above a surface portion of a substrate, and a plurality of electrothermal converting elements which have a heating resistor film for generating thermal energy formed above the electrode wiring. The method includes: forming an electrode wiring layer for forming the electrode wiring, forming the heating resistor film; and collectively etching the electrode wiring layer and the heating resistor film to thereby form the electrode wiring. With the method according to the present invention, the circuit board can be manufactured with a higher density, higher endurance, and lower power consumption recording head to provide high resolution images.
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