发明授权
US07309733B2 Organopolysiloxane composition and electronic part encapsulated therewith 有权
有机聚硅氧烷组合物和封装的电子部件

Organopolysiloxane composition and electronic part encapsulated therewith
摘要:
An organopolysiloxane composition which contains from 0.01% to less than 0.5% by weight of a sulfidable metal powder is provided. When a silver-containing precision electronic part is encapsulated or sealed with the cured composition, the metal powder in the cured composition is sulfided with sulfur-containing gas, thereby preventing or retarding the corrosion of the encapsulated or sealed electronic part with the sulfur-containing gas.
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