发明授权
- 专利标题: Organopolysiloxane composition and electronic part encapsulated therewith
- 专利标题(中): 有机聚硅氧烷组合物和封装的电子部件
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申请号: US10941884申请日: 2004-09-16
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公开(公告)号: US07309733B2公开(公告)日: 2007-12-18
- 发明人: Jun Horikoshi , Tsuneo Kimura
- 申请人: Jun Horikoshi , Tsuneo Kimura
- 申请人地址: JP Tokyo
- 专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 优先权: JP2003-324171 20030917; JP2004-132441 20040428
- 主分类号: C08L83/06
- IPC分类号: C08L83/06
摘要:
An organopolysiloxane composition which contains from 0.01% to less than 0.5% by weight of a sulfidable metal powder is provided. When a silver-containing precision electronic part is encapsulated or sealed with the cured composition, the metal powder in the cured composition is sulfided with sulfur-containing gas, thereby preventing or retarding the corrosion of the encapsulated or sealed electronic part with the sulfur-containing gas.
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