发明授权
US07312145B2 Electronic member, method for making the same, and semiconductor device
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电子元件及其制造方法以及半导体器件
- 专利标题： Electronic member, method for making the same, and semiconductor device
- 专利标题（中）： 电子元件及其制造方法以及半导体器件
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申请号： US10502129申请日： 2003-10-22
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公开(公告)号： US07312145B2公开(公告)日： 2007-12-25
- 发明人: Takeshi Hashimoto
- 申请人： Takeshi Hashimoto
- 申请人地址： JP Chuo-Ku, Tokyo
- 专利权人： Tomoegawa Paper Co., Ltd.
- 当前专利权人： Tomoegawa Paper Co., Ltd.
- 当前专利权人地址： JP Chuo-Ku, Tokyo
- 代理机构： Wood, Herron & Evans
- 优先权： JP2002-308684 20021023
- 国际申请： PCT/JP03/13493 WO 20031022
- 国际公布： WO2004/038799 WO 20040506
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763
摘要：
The present invention provides an electronic device having high insulating reliability, in which metal portions of a circuit are not electrically conductive with each other via an adhesive layer even when the electronic device is used in high-temperature low-humidity conditions or high-temperature high-humidity conditions, and provides a production method for the electronic device, and a semiconductor device comprising the electronic device. In the electronic device in which a circuit formed by pattern formation of metal portions is attached via an adhesive layer to an insulating base, the adhesive layer, which contacts adjacent metal portions, is divided. Typically, the electronic device is one of a lead frame having a lead frame fixing tape, a TAB tape, and a flexible printed circuit board.
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