Invention Grant
- Patent Title: Interface layer for the fabrication of electronic devices
- Patent Title (中): 接口层用于制造电子设备
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Application No.: US11077240Application Date: 2005-03-09
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Publication No.: US07315068B2Publication Date: 2008-01-01
- Inventor: Scott Haubrich , Klaus Kunze , James C. Dunphy , Chris Gudeman , Joerg Rockenberger , Fabio Zurcher , Nassrin Sleiman , Mao Takashima , Chris Spindt
- Applicant: Scott Haubrich , Klaus Kunze , James C. Dunphy , Chris Gudeman , Joerg Rockenberger , Fabio Zurcher , Nassrin Sleiman , Mao Takashima , Chris Spindt
- Applicant Address: US CA Redwood City
- Assignee: Kovio Inc.
- Current Assignee: Kovio Inc.
- Current Assignee Address: US CA Redwood City
- Agency: Haverstock & Owens LLP
- Main IPC: H01L29/94
- IPC: H01L29/94

Abstract:
The present invention is directed to methods for making electronic devices with a thin anisotropic conducting layer interface layer formed between a substrate and an active device layer that is preferably patterned conductive layer. The interface layer preferably provides Ohmic and/or rectifying contact between the active device layer and the substrate and preferably provides good adhesion of the active device layer to the substrate. The active device layer is preferably fashioned from a nanoparticle ink solution that is patterned using embossing methods or other suitable printing and/or imaging methods. The active device layer is preferably patterned into an array of gate structures suitable for the fabrication of thin film transistors and the like.
Public/Granted literature
- US20050164480A1 Interface layer for the fabrication of electronic devices Public/Granted day:2005-07-28
Information query
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