发明授权
- 专利标题： Method for transferring substrates in a load lock chamber
- 专利标题（中）： 在负载锁定室中传送基板的方法
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申请号： US11278318申请日： 2006-03-31
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公开(公告)号： US07316966B2公开(公告)日： 2008-01-08
- 发明人: Shinichi Kurita , Wendell T. Blonigan
- 申请人： Shinichi Kurita , Wendell T. Blonigan
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Patterson & Sheridan, LLP
- 主分类号： H01L21/20
- IPC分类号： H01L21/20
摘要：
Provided herein is a substrate processing system, which comprises a cassette load station; a load lock chamber; a centrally located transfer chamber; and one or more process chambers located about the periphery of the transfer chamber. The load lock chamber comprises double dual slot load locks constructed at same location. Such system may be used for processing substrates for semiconductor manufacturing.
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