发明授权
US07318325B2 Method and apparatus for highly efficient compact vapor compression cooling
有权
用于高效紧凑蒸气压缩冷却的方法和装置
- 专利标题: Method and apparatus for highly efficient compact vapor compression cooling
- 专利标题(中): 用于高效紧凑蒸气压缩冷却的方法和装置
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申请号: US11343431申请日: 2006-01-31
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公开(公告)号: US07318325B2公开(公告)日: 2008-01-15
- 发明人: Daniel P. Rini , Louis Chow , H. Randolph Anderson , Jayanta Sankar Kapat , Bradley Carman , Brian Gulliver , Jose Mauricio Recio
- 申请人: Daniel P. Rini , Louis Chow , H. Randolph Anderson , Jayanta Sankar Kapat , Bradley Carman , Brian Gulliver , Jose Mauricio Recio
- 申请人地址: US FL Oviedo
- 专利权人: Rini Technologies, Inc.
- 当前专利权人: Rini Technologies, Inc.
- 当前专利权人地址: US FL Oviedo
- 代理机构: Saliwanchik, Lloyd & Salinwanchik
- 主分类号: F25B39/04
- IPC分类号: F25B39/04
摘要:
The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface. In another specific embodiment, the heat transfer surface can incorporate surface enhancements which enhance the transfer of heat from the heat transfer surface to the external fluid. In another specific embodiment, an outer layer can be positioned above the heat transfer surface to create a volume between the heat transfer surface and the outer layer through which the external fluid can flow.
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