发明授权
- 专利标题: Method to improve heat dissipation in a magnetic shield
- 专利标题(中): 改善磁屏蔽散热的方法
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申请号: US10696431申请日: 2003-10-29
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公开(公告)号: US07320168B2公开(公告)日: 2008-01-22
- 发明人: Cherng-Chyi Han , Rod Lee , Mao-Min Chen , Pokang Wang
- 申请人: Cherng-Chyi Han , Rod Lee , Mao-Min Chen , Pokang Wang
- 申请人地址: US CA Milpitas
- 专利权人: Headway Technologies, Inc.
- 当前专利权人: Headway Technologies, Inc.
- 当前专利权人地址: US CA Milpitas
- 代理机构: Saile Ackerman LLC
- 代理商 Stephen B. Ackerman
- 主分类号: G11B5/127
- IPC分类号: G11B5/127 ; H04R31/00
摘要:
Problems such as thermal pole tip protrusion result from thermal mismatch between the alumina and pole material during the writing process. This, and similar problems due to inadequate heat dissipation, have been overcome by dividing the bottom shield into two pieces both of which sit on top of a non-magnetic heat sink. Heat generated by the coil during writing is transferred to the non-magnetic heat sink whence it gets transferred to the substrate. With this approach, the head not only benefits from less field disturbance due to the small shield but also improves heat dissipation from the additional heat sink.
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