Invention Grant
- Patent Title: Method to improve heat dissipation in a magnetic shield
- Patent Title (中): 改善磁屏蔽散热的方法
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Application No.: US10696431Application Date: 2003-10-29
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Publication No.: US07320168B2Publication Date: 2008-01-22
- Inventor: Cherng-Chyi Han , Rod Lee , Mao-Min Chen , Pokang Wang
- Applicant: Cherng-Chyi Han , Rod Lee , Mao-Min Chen , Pokang Wang
- Applicant Address: US CA Milpitas
- Assignee: Headway Technologies, Inc.
- Current Assignee: Headway Technologies, Inc.
- Current Assignee Address: US CA Milpitas
- Agency: Saile Ackerman LLC
- Agent Stephen B. Ackerman
- Main IPC: G11B5/127
- IPC: G11B5/127 ; H04R31/00

Abstract:
Problems such as thermal pole tip protrusion result from thermal mismatch between the alumina and pole material during the writing process. This, and similar problems due to inadequate heat dissipation, have been overcome by dividing the bottom shield into two pieces both of which sit on top of a non-magnetic heat sink. Heat generated by the coil during writing is transferred to the non-magnetic heat sink whence it gets transferred to the substrate. With this approach, the head not only benefits from less field disturbance due to the small shield but also improves heat dissipation from the additional heat sink.
Public/Granted literature
- US20050094319A1 Two-piece magnetic shield having improved heat dissipation Public/Granted day:2005-05-05
Information query
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