发明授权
- 专利标题： Flame-retardant heat-resistant resin composition and adhesive film comprising the same
- 专利标题（中）： 阻燃耐热树脂组合物及其粘合膜
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申请号： US10488687申请日： 2002-09-02
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公开(公告)号： US07320830B2公开(公告)日： 2008-01-22
- 发明人: Toshihiko Itou , Masaru Tanaka , Shigehiro Nakamura
- 申请人： Toshihiko Itou , Masaru Tanaka , Shigehiro Nakamura
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Chemical Co., Ltd.
- 当前专利权人： Hitachi Chemical Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2001-269141 20010905; JP2002-137309 20020513
- 国际申请： PCT/JP02/08875 WO 20020902
- 国际公布： WO03/022929 WO 20030320
- 主分类号： B32B27/34
- IPC分类号： B32B27/34 ; B32B27/38 ; C08L63/00 ; C08L77/10 ; C08L79/08
摘要：
The present invention provides a non-flammable heat-resistant resin composition that is provided with (A) modified polyamideimide resin, (B) thermosetting resin and (C) organic phosphor-based compound, and a cured film, obtained from the non-flammable heat-resistant resin composition, exerts a storage elastic modulus of 700 MPa or less, a coefficient of thermal expansion of 5×10−3/K or less and an internal stress of 20 MPa or less, in a temperature range of 25 to 250° C., and the present invention also relates to an adhesive film using the resin composition.
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