发明授权
US07323130B2 Magnification correction employing out-of-plane distortion of a substrate 有权
使用基板的平面外失真的放大率校正

Magnification correction employing out-of-plane distortion of a substrate
摘要:
The present invention is directed to a method of controlling dimensional relations between an original pattern present in a mold and a recorded pattern formed in a layer of a substrate. In this manner, the size of the recorded pattern may appear to be magnified and/or reduced, when compared to the original pattern. To that end, the method comprises defining a region on the layer in which to produce the recorded pattern. The substrate is bent to produce a contoured surface in the region. Dimensional variations in the original pattern are produced by bending the mold, defining a varied pattern. The contoured surface and the mold are provided to have similar radii of curvatures. The varied pattern is then recorded in the layer. These and other embodiments of the present invention are discussed more fully below.
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