发明授权
- 专利标题: Method and composition for polishing a substrate
- 专利标题(中): 抛光基材的方法和组合物
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申请号: US11196876申请日: 2005-08-04
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公开(公告)号: US07323416B2公开(公告)日: 2008-01-29
- 发明人: Feng Q. Liu , Tianbao Du , Alain Duboust , Yan Wang , Yongqi Hu , Stan D. Tsai , Liang-Yuh Chen , Wen-Chiang Tu , Wei-Yung Hsu
- 申请人: Feng Q. Liu , Tianbao Du , Alain Duboust , Yan Wang , Yongqi Hu , Stan D. Tsai , Liang-Yuh Chen , Wen-Chiang Tu , Wei-Yung Hsu
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Paterson & Sheridan
- 主分类号: H01L21/302
- IPC分类号: H01L21/302
摘要:
Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique, and then polishing the substrate by at least a chemical mechanical polishing technique.
公开/授权文献
- US20060006074A1 Method and composition for polishing a substrate 公开/授权日:2006-01-12