发明授权
- 专利标题: Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board
- 专利标题(中): 使用从电路板的下侧安装的锚固件将散热器附接到电路板的技术
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申请号: US11001411申请日: 2004-12-01
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公开(公告)号: US07324344B2公开(公告)日: 2008-01-29
- 发明人: George Sya , Hong Huynh , Michael Koken
- 申请人: George Sya , Hong Huynh , Michael Koken
- 申请人地址: US CA San Jose
- 专利权人: Cisco Technology, Inc.
- 当前专利权人: Cisco Technology, Inc.
- 当前专利权人地址: US CA San Jose
- 代理机构: BainwoodHuang
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A heatsink attachment assembly includes a first anchor, a second anchor and a heatsink clip. The first anchor is configured to insert into a first hole in a circuit board in an upward direction from an underside of the circuit board toward a topside of the circuit board. Similarly, the second anchor is configured to insert into a second hole in the circuit board in the upward direction. The heatsink clip has (i) a first end configured to fasten to the first anchor when the first anchor is inserted into the first hole in the circuit board, (ii) a second end configured to fasten to the second anchor when the second anchor is inserted into the second hole in the circuit board, and (iii) a middle section configured to provide force on a heatsink in a downward direction which is substantially opposite the upward direction.