发明授权
- 专利标题: Methods and apparatus for testing a link between chips
- 专利标题(中): 测试芯片之间链路的方法和装置
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申请号: US11344902申请日: 2006-02-01
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公开(公告)号: US07324913B2公开(公告)日: 2008-01-29
- 发明人: Scott Douglas Clark , Dorothy Marie Thelen
- 申请人: Scott Douglas Clark , Dorothy Marie Thelen
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Dugan & Dugan
- 主分类号: G06F19/00
- IPC分类号: G06F19/00
摘要:
In a first aspect, a first method of testing a link between a first chip and a second chip is provided. The first method includes the steps of, while operating in a test mode, (1) transmitting test data of sufficient length to enable exercising of worst case transitions from the first chip to the second chip via the link; and (2) performing cyclic redundancy checking (CRC) on the test data to test the link. Numerous other aspects are provided.
公开/授权文献
- US20070179733A1 Methods and apparatus for testing a link between chips 公开/授权日:2007-08-02
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