发明授权
- 专利标题： Method and circuit structure employing a photo-imaged solder mask
- 专利标题（中）： 使用光成像焊接掩模的方法和电路结构
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申请号： US11135967申请日： 2005-05-24
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公开(公告)号： US07326636B2公开(公告)日： 2008-02-05
- 发明人: Ling Liu , Albert An-Bon Yeh , Paul Thomas Carson
- 申请人： Ling Liu , Albert An-Bon Yeh , Paul Thomas Carson
- 申请人地址： US CA Santa Clara
- 专利权人： Agilent Technologies, Inc.
- 当前专利权人： Agilent Technologies, Inc.
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L23/48
摘要：
In one embodiment, a photo-imageable material is deposited on a circuit structure. The photo-imageable material is then exposed to a pattern of radiation, thereby polymerizing portions of the photo-imageable. Un-polymerized portions of the photo-imageable material are then removed to define a solder mask having solder deposition areas. Solder is then deposited in the solder deposition areas. A circuit structure that may be produced in accordance with this method is also disclosed.
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