Invention Grant
- Patent Title: Contact image-sensing module having fingerprint scanning function
- Patent Title (中): 联系具有指纹扫描功能的图像感测模块
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Application No.: US11259124Application Date: 2005-10-27
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Publication No.: US07326912B2Publication Date: 2008-02-05
- Inventor: Chia-Chu Cheng , Tzu-Heng Liu , Ming-Ho Wang
- Applicant: Chia-Chu Cheng , Tzu-Heng Liu , Ming-Ho Wang
- Applicant Address: TW Taipei
- Assignee: Lite-On Semiconductor Corp.
- Current Assignee: Lite-On Semiconductor Corp.
- Current Assignee Address: TW Taipei
- Agency: Rosenberg, Klein & Lee
- Priority: TW93220607U 20041221
- Main IPC: H01L27/00
- IPC: H01L27/00 ; G06K9/00

Abstract:
A contact image-sensing module having fingerprint-scanning function is described. The image-sensing module has a flex/rigid composite substrate having a first rigid circuit substrate, a second rigid circuit substrate, a third rigid circuit substrate, and at least one flex circuit board. The first rigid circuit substrate, the second rigid circuit substrate, and the third rigid circuit substrate respectively and electrically connect to the flex circuit board in order to form a first composite substrate, a second composite substrate, and a third composite substrate. Each of the second composite substrate and the third composite substrate respectively is not located in the same plane and has a predetermined angle with respect to the plane where the first composite plane is located.
Public/Granted literature
- US20060133655A1 Contact image-sensing module having fingerprint scanning function Public/Granted day:2006-06-22
Information query
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