发明授权
- 专利标题: Processor module with thermal dissipation device
- 专利标题(中): 带散热装置的处理器模块
-
申请号: US11011328申请日: 2004-12-13
-
公开(公告)号: US07327569B2公开(公告)日: 2008-02-05
- 发明人: Christian L. Belady , Gary W. Williams , Shaun L. Harris , Steven A. Belson , Eric C. Peterson
- 申请人: Christian L. Belady , Gary W. Williams , Shaun L. Harris , Steven A. Belson , Eric C. Peterson
- 申请人地址: US TX Houston
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Houston
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
Embodiments include apparatus, methods, and systems of a processor module for a system board. An electronic module is removably connectable to a system board. The electronic module has first and second portions. The first portion is connected to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device extends between the processor and the system board. The second portion connects on top of the first portion and has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.
公开/授权文献
- US20060126297A1 Processor module with thermal dissipation device 公开/授权日:2006-06-15
信息查询