发明授权
- 专利标题: Thermal load balancing systems and methods
- 专利标题(中): 热负荷平衡系统和方法
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申请号: US11220049申请日: 2005-09-06
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公开(公告)号: US07327571B2公开(公告)日: 2008-02-05
- 发明人: Jeffery M. Giardina , Wade D. Vinson , Thomas G. Bumby, Jr.
- 申请人: Jeffery M. Giardina , Wade D. Vinson , Thomas G. Bumby, Jr.
- 申请人地址: US TX Houston
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Houston
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
Systems and methods for implementing thermal load balancing are disclosed. In an exemplary embodiment, a thermal load balancing system for a multiprocessor computer having a plurality of processors may comprise a heat sink network having a plurality of local heat sinks. The local heat sinks are thermally coupled to separate processors in the multiprocessor computer. At least one heat pipe thermally couples each of the plurality of local heat sinks in the heat sink network.
公开/授权文献
- US20070053161A1 Thermal load balancing systems and methods 公开/授权日:2007-03-08