Invention Grant
- Patent Title: Silicon microphone with softly constrained diaphragm
- Patent Title (中): 硅麦克风具有柔软约束的隔膜
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Application No.: US10977693Application Date: 2004-10-29
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Publication No.: US07329933B2Publication Date: 2008-02-12
- Inventor: Wang Zhe , Miao Yubo
- Applicant: Wang Zhe , Miao Yubo
- Applicant Address: SG Singapore
- Assignee: Silicon Matrix Pte. Ltd.
- Current Assignee: Silicon Matrix Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Saile Ackerman LLC
- Agent Stephen B. Ackerman
- Main IPC: H01L29/84
- IPC: H01L29/84

Abstract:
A microphone sensing element and a method for making the same are disclosed. The sensing element has a diaphragm and an attached electrical lead-out arm preferably made of polysilicon that are separated by an air gap from an underlying backplate region created on a conductive silicon substrate. The backplate region has acoustic holes created by removing an oxide filling in a continuous trench that surrounds hole edges and by removing oxide to form the air gap. The diaphragm is softly constrained along its edge by an elastic element that connects to a surrounding rigid polysilicon layer. The elastic element is typically a polymer such as parylene having a Young's modulus substantially less than that of the diaphragm. First and second electrodes are connected to the diaphragm through the lead-out arm and to the substrate through polysilicon via fillings, respectively, and thereby establish a variable capacitor circuit for acoustic sensing.
Public/Granted literature
- US20060093171A1 Silicon microphone with softly constrained diaphragm Public/Granted day:2006-05-04
Information query
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