发明授权
US07332376B2 Method of encapsulating packaged microelectronic devices with a barrier
有权
封装具有屏障的封装微电子器件的方法
- 专利标题: Method of encapsulating packaged microelectronic devices with a barrier
- 专利标题(中): 封装具有屏障的封装微电子器件的方法
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申请号: US11516455申请日: 2006-09-05
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公开(公告)号: US07332376B2公开(公告)日: 2008-02-19
- 发明人: Chad A. Cobbley
- 申请人: Chad A. Cobbley
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Perkins Coie LLP
- 主分类号: H01L21/48
- IPC分类号: H01L21/48 ; H01L23/48 ; H05K3/30
摘要:
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged microelectronic device assembly includes a microelectronic die, a substrate attached to the die, a protective casing covering a portion of the substrate, and a barrier projecting away from the surface of the substrate. The microelectronic die can have an integrated circuit and a plurality of bond-pads operatively coupled to the integrated circuit. The substrate can have a cap-zone defined by an area that is to be covered by the protective casing, a plurality of contact elements arranged in the cap-zone, a plurality of ball-pads arranged in a ball-pad array outside of the cap-zone, and a plurality of conductive lines coupling the contact elements to the ball-pads. The contact elements are electrically coupled to corresponding bond-pads on the microelectronic die, and the protective casing covers the cap-zone. The barrier on the surface of the substrate is configured so that at least a portion of the barrier is outside of the cap-zone and adjacent to at least a portion of the molded section. The barrier is a seal that inhibits the thermosetting material of the protective casing from covering a portion of the substrate outside of the cap-zone. As such, the barrier prevents thermosetting material from leaking between the substrate and a mold outside of the cap-zone during a molding process.