发明授权
- 专利标题: Methods of fabricating fin field transistors
- 专利标题(中): 散射场晶体管的制造方法
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申请号: US11084922申请日: 2005-03-21
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公开(公告)号: US07332386B2公开(公告)日: 2008-02-19
- 发明人: Chul Lee , Min-Sang Kim , Dong-gun Park , Choong-ho Lee , Chang-woo Oh , Jae-man Yoon , Dong-won Kim , Jeong-dong Choe , Ming Li , Hye-jin Cho
- 申请人: Chul Lee , Min-Sang Kim , Dong-gun Park , Choong-ho Lee , Chang-woo Oh , Jae-man Yoon , Dong-won Kim , Jeong-dong Choe , Ming Li , Hye-jin Cho
- 申请人地址: KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR
- 代理机构: Myers Bigel Sibley & Sibley, P.A.
- 优先权: KR10-2004-0019711 20040323; KR10-2004-0071798 20040908
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L21/8234 ; H01L21/8238
摘要:
A fin field effect transistor (FinFET) includes a substrate, a fin, a gate electrode, a gate insulation layer, and source and drain regions in the fin. The fin is on and extends laterally along and vertically away from the substrate. The gate electrode covers sides and a top of a portion of the fin. The gate insulation layer is between the gate electrode and the fin. The source region and the drain region in the fin and adjacent to opposite sides of the gate electrode. The source region of the fin has a different width than the drain region of the fin.
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