Invention Grant
- Patent Title: Apparatus and method for inspecting defects
- Patent Title (中): 用于检查缺陷的装置和方法
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Application No.: US11653322Application Date: 2007-01-16
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Publication No.: US07333192B2Publication Date: 2008-02-19
- Inventor: Hiroyuki Nakano , Akira Hamamatsu , Sachio Uto , Yoshimasa Oshima , Hidetoshi Nishiyama , Yuta Urano , Shunji Maeda
- Applicant: Hiroyuki Nakano , Akira Hamamatsu , Sachio Uto , Yoshimasa Oshima , Hidetoshi Nishiyama , Yuta Urano , Shunji Maeda
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2006-013285 20060123
- Main IPC: G01N21/88
- IPC: G01N21/88

Abstract:
A defect inspection apparatus includes an irradiation optical system 20, a detection optical system 30, and an image processor 40. In the irradiation optical system, a mirror 2603 is disposed to reflect downward a beam flux that has been guided to a first or second optical path, and a cylindrical lens 251 and an inclined mirror 2604 are disposed to focus the beam flux that has been directed downward by the mirror, at an inclination angle from a required oblique direction extending horizontally, onto a substrate 1 to be inspected, as a slit-shaped beam 90.
Public/Granted literature
- US20070177136A1 Apparatus and method for inspecting defects Public/Granted day:2007-08-02
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