发明授权
US07333346B2 Circuit board having test coupon and method for evaluating the circuit board
有权
具有用于评估电路板的测试券和方法的电路板
- 专利标题: Circuit board having test coupon and method for evaluating the circuit board
- 专利标题(中): 具有用于评估电路板的测试券和方法的电路板
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申请号: US10983977申请日: 2004-11-09
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公开(公告)号: US07333346B2公开(公告)日: 2008-02-19
- 发明人: Tomoyuki Miyagawa , Toshiharu Shiratsuchi , Isao Tanooka , Hideaki Sugiura
- 申请人: Tomoyuki Miyagawa , Toshiharu Shiratsuchi , Isao Tanooka , Hideaki Sugiura
- 申请人地址: JP Kariya
- 专利权人: DENSO CORPORATION
- 当前专利权人: DENSO CORPORATION
- 当前专利权人地址: JP Kariya
- 代理机构: Posz Law Group, PLC
- 优先权: JP2003-381586 20031111
- 主分类号: H05K1/00
- IPC分类号: H05K1/00
摘要:
A circuit board includes: a substrate; a conductive pattern disposed on a surface of the substrate; a lower insulation layer disposed on the conductive pattern to cover the conductive pattern except for an opening, through which the conductive pattern is partially exposed from the lower insulation layer; a conductor disposed on the lower insulation layer and connecting to the conductive pattern through the opening; an upper insulation layer disposed on the conductor for covering the conductor and the lower insulation layer; and a test coupon disposed on the substrate for evaluating the conductor.
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