发明授权
US07335541B2 Method for fabricating thin film transistor using the mask for forming polysilicon including slit patterns deviated from each other
有权
使用该掩模制造薄膜晶体管的方法,用于形成包括彼此偏离的狭缝图案的多晶硅
- 专利标题: Method for fabricating thin film transistor using the mask for forming polysilicon including slit patterns deviated from each other
- 专利标题(中): 使用该掩模制造薄膜晶体管的方法,用于形成包括彼此偏离的狭缝图案的多晶硅
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申请号: US10854664申请日: 2004-05-26
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公开(公告)号: US07335541B2公开(公告)日: 2008-02-26
- 发明人: Myung-Koo Kang , Sook-Young Kang , Hyun-Jae Kim
- 申请人: Myung-Koo Kang , Sook-Young Kang , Hyun-Jae Kim
- 申请人地址: KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR
- 代理机构: F. Chau & Assoc., LLC
- 优先权: KR2001-50421 20010821; KR2002-7365 20020208
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A mask for crystallization of amorphous silicon to polysilicon is provided. The mask includes a plurality of slit patterns for defining regions to be illuminated. The plurality of slit patterns are formed along a longitudinal first direction and the mask moves along a longitudinal second direction. The first longitudinal direction is substantially perpendicular to the second longitudinal direction. Each of the split patterns is deviated apart by substantially a same distance from another. Thus, the polysilicon using the mask are grown to be isotropic with respect to the horizontal and vertical directions.
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