发明授权
- 专利标题: Method for manufacturing semiconductor chip
- 专利标题(中): 制造半导体芯片的方法
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申请号: US10490557申请日: 2003-04-09
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公开(公告)号: US07335578B2公开(公告)日: 2008-02-26
- 发明人: Masateru Fukuoka , Munehiro Hatai , Satoshi Hayashi , Yasuhiko Oyama , Shigeru Danjo , Masahiko Kitamura , Koichi Yajima
- 申请人: Masateru Fukuoka , Munehiro Hatai , Satoshi Hayashi , Yasuhiko Oyama , Shigeru Danjo , Masahiko Kitamura , Koichi Yajima
- 申请人地址: JP Osaka JP Tokyo
- 专利权人: Sekisui Chemical Co., Ltd.,Disco Corporation
- 当前专利权人: Sekisui Chemical Co., Ltd.,Disco Corporation
- 当前专利权人地址: JP Osaka JP Tokyo
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2002-109178 20020411
- 国际申请: PCT/JP03/04472 WO 20030409
- 国际公布: WO03/085714 WO 20031016
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A semiconductor wafer (W) where circuits are formed in the area divided by streets is split into semiconductor chips having individual circuits. By interposing an adhesive sheet, whose adhesive force is lowered by stimulation, between the semiconductor wafer (W) and the support plate (13), the front side of the semiconductor wafer (W) is adhered to the support plate (13), thereby exposing the rear face (10) of the semiconductor wafer (W). The rear face (10) of the semiconductor wafer (W) with the support plate (13) is ground. After the grinding is finished, the semiconductor wafer (W) held with the rear face (10) up is diced into semiconductor chips (C). The adhesive sheet is given stimulus to lower the adhesive force and the semiconductor chips (C) are removed from the support plate (13). The semiconductor wafer and semiconductor chips are always supported by the support plate, avoiding damage and deformation.
公开/授权文献
- US20040259332A1 Method for manufacturing semiconductor chip 公开/授权日:2004-12-23