Invention Grant
- Patent Title: EMI-resistant circuit board assembly
- Patent Title (中): 抗EMI电路板组装
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Application No.: US11515772Application Date: 2006-09-06
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Publication No.: US07341488B2Publication Date: 2008-03-11
- Inventor: Bor-Ching Yang , Ping-Hui Chen , Jui-Chuan Huang
- Applicant: Bor-Ching Yang , Ping-Hui Chen , Jui-Chuan Huang
- Applicant Address: TW Taipei
- Assignee: Askey Computer Corp.
- Current Assignee: Askey Computer Corp.
- Current Assignee Address: TW Taipei
- Agency: Browdy and Neimark, PLLC
- Priority: TW95202090U 20060127
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
An EMI-resistant circuit board assembly includes a plurality of circuit boards arranged in a stack and a metal shielding frame respectively sandwiched in between each two adjacent circuit boards. One of the circuit boards has at least one high-speed device producing high-frequency noises to the ambient, which result in EMI effect. The metal shielding frame is electrically connected to the ground potential of the circuit boards and shields the high-speed device on the circuit board to guide the high-frequency noises to the ground potential.
Public/Granted literature
- US20070178763A1 EMI-resistant circuit board assembly Public/Granted day:2007-08-02
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