Invention Grant
- Patent Title: Modular jack having electrical wires through a side wall thereof
- Patent Title (中): 具有穿过其侧壁的电线的模块式插座
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Application No.: US10863412Application Date: 2004-06-07
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Publication No.: US07341492B2Publication Date: 2008-03-11
- Inventor: Haiwei Wang , Yi Sheng Lin
- Applicant: Haiwei Wang , Yi Sheng Lin
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Wei Te Chung
- Priority: CN03265892 20030605
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
A modular jack (100) includes an insulative housing (2) and a terminal-receiving part (3) having a pair of terminals (4) therein received in the housing (2). The terminal-receiving part (3) includes a pair of through apertures (341) accommodating the terminals (4), a leading-wire notch (325) positioned behind the apertures (341) and a leading-wire space (324) communicating with the leading-wire notch (325). A hole (211) is defined in a corresponding side wall (21) of the housing (2). A pair of wires (344) connecting to leading-wire end (41) of the terminals (4) extends through the leading-wire notch (325) and leading-wire space (324) out of the hole (211) of the side wall (21) of the housing (2).
Public/Granted literature
- US20040248473A1 Modular jack having electrical wires through a side wall thereof Public/Granted day:2004-12-09
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