Invention Grant
- Patent Title: Digital camera module package fabrication method
- Patent Title (中): 数码相机模块封装制造方法
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Application No.: US11453454Application Date: 2006-06-14
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Publication No.: US07342215B2Publication Date: 2008-03-11
- Inventor: Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
- Applicant: Steven Webster , Ying-Cheng Wu , Kun-Hsieh Liu
- Applicant Address: TW Chu-Nan, Miao-Li Hsien
- Assignee: Altus Technology Inc.
- Current Assignee: Altus Technology Inc.
- Current Assignee Address: TW Chu-Nan, Miao-Li Hsien
- Agent Jeffrey T. Knapp
- Priority: CN200510037226 20050909
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01J5/02
Abstract:
A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322); Secondly, mounting an image sensor chip (34) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (36), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means (3262) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover (38) on the carrier, where an adhesive means fixes the cover in place.
Public/Granted literature
- US20070057148A1 Digital camera module package fabrication method Public/Granted day:2007-03-15
Information query
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