发明授权
- 专利标题: Power and ground buss layout for reduced substrate size
- 专利标题(中): 电源和接地总线布局,以减小基板尺寸
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申请号: US11676551申请日: 2007-02-20
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公开(公告)号: US07344227B2公开(公告)日: 2008-03-18
- 发明人: David G. King , Kristi M. Rowe
- 申请人: David G. King , Kristi M. Rowe
- 申请人地址: US KY Lexington
- 专利权人: Lexmark International, Inc.
- 当前专利权人: Lexmark International, Inc.
- 当前专利权人地址: US KY Lexington
- 代理机构: Luedeka, Neely & Graham PC
- 主分类号: B41J2/05
- IPC分类号: B41J2/05
摘要:
A semiconductor substrate for a micro-fluid ejection device. The substrate includes plurality of micro-fluid ejection actuators disposed adjacent a fluid supply slot in the semiconductor substrate. A plurality of power transistors, occupying a power transistor active area of the substrate, are disposed adjacent the ejection actuators and are connected through a first metal conductor layer to the ejection actuators. An array of logic circuits, occupying a logic circuit area of the substrate, is disposed adjacent the plurality of power transistors and is connected through a polysilicon conductor layer to the power transistors. A power conductor and a ground conductor for the ejection actuators is routed in a second metal conductor layer. The power conductor overlaps at least a portion of the power transistor active area of the substrate and the ground conductor overlaps at least a portion of the logic circuit area of the substrate.
公开/授权文献
- US20070139475A1 POWER AND GROUND BUSS LAYOUT FOR REDUCED SUBSTRATE SIZE 公开/授权日:2007-06-21