发明授权
- 专利标题: Topographically defined thin film CPP read head fabrication
- 专利标题(中): 图形定位薄膜CPP读头制造
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申请号: US10815447申请日: 2004-03-31
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公开(公告)号: US07344330B2公开(公告)日: 2008-03-18
- 发明人: David Eugene Heim , Kim Y. Lee , Tsann Lin , Jih-Shiuan Luo
- 申请人: David Eugene Heim , Kim Y. Lee , Tsann Lin , Jih-Shiuan Luo
- 申请人地址: NL Amsterdam
- 专利权人: Hitachi Global Storage Technologies Netherlands B.V.
- 当前专利权人: Hitachi Global Storage Technologies Netherlands B.V.
- 当前专利权人地址: NL Amsterdam
- 代理机构: Zilka-Kotab, PC
- 主分类号: G11B5/127
- IPC分类号: G11B5/127
摘要:
A method of constructing a small trackwidth magnetorsesistive sensor by defining a trench between first and second hard bias layers and depositing the sensor into the trench.