发明授权
- 专利标题: Substrate processing equipment
- 专利标题(中): 基板加工设备
-
申请号: US10550202申请日: 2004-06-18
-
公开(公告)号: US07346273B2公开(公告)日: 2008-03-18
- 发明人: Kazuo Tanaka , Masaaki Ueno , Masashi Sugishita
- 申请人: Kazuo Tanaka , Masaaki Ueno , Masashi Sugishita
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Kokusai Electric Inc
- 当前专利权人: Hitachi Kokusai Electric Inc
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff & Berridge, PLC
- 优先权: JP2003-202433 20030728
- 国际申请: PCT/JP2004/008603 WO 20040618
- 国际公布: WO2005/010970 WO 20050203
- 主分类号: F26B3/30
- IPC分类号: F26B3/30 ; H05B3/02
摘要:
It is an object of the invention to provide a substrate processing equipment that can predict a temperature of a substrate and easily control temperature of the substrate. Formed in a reactor (processing chamber) 3 are four temperature adjustment zones, of which setting and adjustment of temperature can be made by zone heaters 340-1 to 340-4. A temperature controller 4 mixes temperatures detected by inner thermocouples 302-1 to 302-4 and outer thermocouples 342-1 to 342-4 to calculate predicted temperatures of substrates by means of the first-order lag calculation on the basis of time constants of temperatures of substrates heated by the zone heaters 340-1 to 340-4. Also, the temperature controller 4 calculates electric power values (operating variables) for the zone heaters 340-1 to 340-4 with the use of predicted temperatures of substrates to output the same to the zone heaters 340-1 to 340-4.
公开/授权文献
信息查询
IPC分类: