A Light Emitting Diode (LED) lamp assembly comprises a base, a plurality of linear-extended LED lighting sources, a reflecting and heat-dissipating module, and a thermal module. The linear-extended LED lighting sources are distributed and connected to the base for optionally projecting at least one projecting light and releasing light heat simultaneously. The reflecting and heat-dissipating module is provided with a central heat-dissipating region approximately located on a central region of all the LED lighting sources and a plurality of reflecting and heat-dissipating members radially extended from the central heat-dissipating region for separating the linear-extended LED light sources, reflecting the projecting light, absorbing and conducting the light heat. The thermal module is arranged within the central heat-dissipating region for dissipating the light heat absorbed and conducted by the reflecting and heat-dissipating members.