Invention Grant
US07347702B2 Contact carriers (tiles) for populating larger substrates with spring contacts
失效
接触托架（瓷砖），用于通过弹簧触点填充较大的基板
- Patent Title: Contact carriers (tiles) for populating larger substrates with spring contacts
- Patent Title (中): 接触托架（瓷砖），用于通过弹簧触点填充较大的基板
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Application No.: US11561297Application Date: 2006-11-17
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Publication No.: US07347702B2Publication Date: 2008-03-25
- Inventor: Benjamin N. Eldridge , Thomas H. Dozier, II , Igor Y. Khandros , Gaetan L. Mathieu , William D. Smith
- Applicant: Benjamin N. Eldridge , Thomas H. Dozier, II , Igor Y. Khandros , Gaetan L. Mathieu , William D. Smith
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agent N. Kenneth Burraston
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.
Public/Granted literature
- US20070075715A1 Contact Carriers (Tiles) For Populating Larger Substrates With Spring Contacts Public/Granted day:2007-04-05
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